Russian
Diamond thick film welding tool
2012-12-16 by seoer10
The diamond thick film production process of the welding tool generally include: The preparation of a large area of ??the diamond film; diamond film was cut into the shape and dimensions of the tool; diamond thick film with the tool base material of the welding; the grinding and polishing of the cutting edge of diamond thick film .
Preparation and cutting of thick diamond films
Commonly used in the preparation process of the diamond thick DC plasma jet CVD method. The diamond is deposited to a WC + Co alloy (surface subjected to mirror processing), in the cooling process of the substrate, the diamond film is automatically shed. This method is the deposition speed (up to 930μm / h), the lattice binding between more closely, but the growth of the surface is relatively rough. The diamond films of high hardness, wear-resistant, non-conductive to determine it the cutting method is a laser cutting (cutting in the environment of air, oxygen and argon). Laser cutting can not only diamond thick film was cut into a desired shape and size, can also be cut out of the rear corners of the tool, with a narrow kerf, efficiency and other advantages.abrasive tools
Diamond Thick Film Cutters Welding
Between diamond and metals and their alloys having a high interfacial energy, resulting in diamond can not be generally low-melting alloy infiltration, weldability Terrible. Now primarily to add a strong carbide forming element or through the metalization process of the diamond surface to improve the weldability between the diamond and the metal in the copper-silver alloy solder.
Active brazing method
Solder generally use a copper-silver alloy containing Ti, without flux in an inert gas or in vacuum soldering. Common component solder Ag = 68.8wt%, Cu = 26.7wt%, Ti = 4.5 wt%, the preparation method is commonly used in the arc melting method and powder metallurgy. Ti as active elements in the welding process and C reflect the generation of TiC can be improved diamond and the solder wettability and bonding strength. The heating temperature usually is 850 ℃, incubated for 10 minutes, slow cooling in order to reduce internal stress.grinding disc
Preparation and cutting of thick diamond films
Commonly used in the preparation process of the diamond thick DC plasma jet CVD method. The diamond is deposited to a WC + Co alloy (surface subjected to mirror processing), in the cooling process of the substrate, the diamond film is automatically shed. This method is the deposition speed (up to 930μm / h), the lattice binding between more closely, but the growth of the surface is relatively rough. The diamond films of high hardness, wear-resistant, non-conductive to determine it the cutting method is a laser cutting (cutting in the environment of air, oxygen and argon). Laser cutting can not only diamond thick film was cut into a desired shape and size, can also be cut out of the rear corners of the tool, with a narrow kerf, efficiency and other advantages.abrasive tools
Diamond Thick Film Cutters Welding
Between diamond and metals and their alloys having a high interfacial energy, resulting in diamond can not be generally low-melting alloy infiltration, weldability Terrible. Now primarily to add a strong carbide forming element or through the metalization process of the diamond surface to improve the weldability between the diamond and the metal in the copper-silver alloy solder.
Active brazing method
Solder generally use a copper-silver alloy containing Ti, without flux in an inert gas or in vacuum soldering. Common component solder Ag = 68.8wt%, Cu = 26.7wt%, Ti = 4.5 wt%, the preparation method is commonly used in the arc melting method and powder metallurgy. Ti as active elements in the welding process and C reflect the generation of TiC can be improved diamond and the solder wettability and bonding strength. The heating temperature usually is 850 ℃, incubated for 10 minutes, slow cooling in order to reduce internal stress.grinding disc
keywords: nonwoven belt