The ultra-thin diamond cutting tool is mainly used in the field of electronic information industry integrated circuit chip and a variety of electronic components draw off and slotted. The dicing sheet thickness (generally 0.015 ~ 0.1mm); high accuracy (the accuracy of the thickness dimension is generally <0.003mm, roundness and concentricity of <0.01mm, parallelism <0.005mm); high intensity; rigidity; within stress (the work line speeds of up to 100m / s or so). Has the advantages of high cutting speed, kerf small, chipping, high material utilization, high precision workpiece surface quality, fully able to meet the needs of the LSI chip for the field of electronic information processing and a variety of electronic components. At present, the thin diamond tool developed mainly there are two methods, i.e. the pressing method and the electroforming method. Electroforming low temperature than the pressing method, simple equipment, developed the abrasive tools  thinner, and therefore has more advantages. Electroforming method developed ultra-thin diamond cutter ongoing research and development of this work abroad to achieve practical application only Japan DISCO, Mitsubishi Corporation, South Korea's Shinhan few, are only a small number of research units is still in its infancy. Electroforming the development of ultra-thin diamond cutting disc, tool industry in China can improve the level of manufacturing, import substitution, and to play a positive role in promoting the development of China's electronic information industry.